THIN FILM PROCESSING

• Thermal Oxide
• Low Temp Oxide (LTO)
• Low-K Oxide (K<3)
• PETEOS Oxide
• POCL3 (Phos) Doping & N+ Drive Poly
• Plasma Oxide

• Silicon Carbide
• Polysilicon
• PECVD Amorphous Silicon
• LPCVD Silicon Nitride
• Plasma Nitride

• Oxy-Nitride
• SiON
• BPSG
• Photoresist Coating (I-Line/DUV)
• Electroplated Copper (ECP)

PVD Metals

• PVD Al
• PVD Al Alloys
• PVD Cu
• PVD Ti
• PVD TiN
• PVD Ta
• PVD TaN
• PVD W
• PVD WTi (90/10)

• PVD Cr
• PVD NiV
• PVD NiFe
• PVD ITO (90/10)
• PVD Co
• PVD CoFe
• PVD C
• PVD Si
• PVD Zr

• PVD Nb
• PVD Mg
• PVD SiO2
• PVD Al2O3
• PVD AlN
• PVD Mo
• PVD Au
• PVD Pt
• PVD Pd
• PVD Ag

CUSTOM PROCESSING

• Oxide Stripping
• Photoresist Stripping
• Metal Stripping
• Wafer Cleaning
• Wafer Polishing

• Epitaxial Services
• Dicing
• Lapping
• Laser Marking

• Wafer Reclaiming
• Wafer Thinning
• Wafer Grinding
• Patterning

Testing

• Step Heights
• Surface Roughness
• Film Stress

• Resistance Mapping
• Uniformity Mapping

• Particle Scanning
• Bow/Warp Measurments